Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market
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Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market was valued USD XX Bn in 2019 and is expected to reach US$ XX Bn by 2026, at CAGR of XX% during forecast period of 2019 to 2026.
The report includes the analysis of impact of COVID-19 lock-down on the revenue of market leaders, followers, and disrupters. Since lock down was implemented differently in different regions and countries, impact of same is also different by regions and segments. The report has covered the current short term and long term impact on the market, same will help decision makers to prepare the outline for short term and long term strategies for companies by region.
Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Drivers and Restrains:
The advancement of technologies, the change of consumer attitudes and the large quantity of waste electrical and electronic equipment (WEEE) is increasing annually. In light of their characteristics including complex structures, high metals content and potential hazards due to these factors waste PCBs are regarded as the most difficult parts of WEEE to be recycled. Hence, the issue has attracted much attention from researchers and enterprises in the recent ten years. The latest technology for waste PCBs typically categorized as manually dismantling and automatic approaches in developing and developed countries, respectively. Towards achieving the better sustainability and recyclability for waste PCBs, nonmetal powder and precious metals should be developed for a deep recovery using mechanical treatment. A significant shift is emerging from dismantling for recycling of printed circuit boards, to disassembling for remanufacturing of electronic components, which will indicate that a new paradigm of retrieving waste PCBs is shaping.
Manufacturers in the E-scrap and printed circuit board (PCB) E-scrap are focusing on competitive pricing as the strategy to capture significant market share. Moreover, strategic mergers and acquisitions and technological innovations are also the key focus areas of the manufacturers.
Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Segmentation Analysis:
Based on source of e-scrap, the market is classified into household appliances, IT and telecommunication products and entertainment devices. E-waste produced from household appliances accounted for the maximum share of the global e-waste market in 2016, at around XX% of the volume of the overall e-scrap and printed circuit board (PCB) e-scrap market. Moreover, the segment is expected to show sustainable growth throughout the forecast period due to high usage of various types of electronic equipment in household application in terms of units.
In terms of PCB e-waste type, the market is segmented into telecommunication circuit cards, network communication boards, circuit packs and PC motherboards. The telecommunication circuit cards segment held the largest volume share of around XX% and a value share of XX% in the overall PCB e-scrap market in 2016. Moreover, it is expected to dominate the market throughout the forecast period.
In terms of material extracted from PCB e-scrap, the market is segmented into ferrous components, metals (copper, aluminum, tin), and precious metals (gold, silver, palladium). The metals segment held the largest volume share of around XX% and value share of XX% in the overall e-scrap and PCB e-scrap market in 2016.
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